Heat Transfer

Laminar air flow through plate fins in the microchannel heat sink built into the back of an integrated circuit chip. This figure shows the pressure distribution; the corresponding temperature distribution is shown on the front cover, where the flow direction is upward. The Reynolds number based on t [...]
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Laminar air flow through plate fins in the microchannel heat sink built into the back of an integrated circuit chip. This figure shows the pressure distribution; the corresponding temperature distribution is shown on the front cover, where the flow direction is upward. The Reynolds number based on the swept length of the plate fin is 150. The optimization of a related microchannel geometry is proposed in Project 6.4 in the text.